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Die Bonding Information by advanced-packaging.info

Datacon A Leading Name in Technology

We would like to take this opportunity to introduce Datacon Technology AG, a known internationally operating group of companies which develops and produces high-precision machines for the semiconductor industry. A supplier to leading microelectronics companies across the globe. Datacon – your essential technology partner for semiconductor production equipment.
Our team of 450 staff under the umbrella of Datacon Technology AG, 110 of whom work in Research and Development, can handle large & small orders. Datacon Semiconductor Equipment GmbH, Radfeld / Austria (development and production of die bonders), Eurotec GmbH, Berlin / Germany (special-purpose machine construction), and Datacon Hungary Kft, Györ / Hungary (component manufacture, assembly) are responsible for the business operations. We have global operations.
Our vision is to successfully contribute to the advancement of microelectronics by addressing and implementing the current and future requirements of the fast-moving Advanced Packaging Market. We look forward to working with you.

Die Bonding Information by advanced-packaging.info

Die Bonding Information by advanced-packaging.info
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